| 9.27.10. |
OSB and Waferboard |
| 9.27.10.1. |
Material Standard
- OSB and waferboard cladding shall conform to CSA O437.0, "OSB and Waferboard."
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| 9.27.10.2. |
Thickness
- OSB conforming to O-2 grade shall be not less than 6.0 mm thick where applied directly to sheathing.
- OSB conforming to O-2 grade applied directly to framing or over furring strips shall conform to the thickness shown for plywood in Table 9.27.8.2. (See Note A-9.27.10.2.(2).)
- OSB conforming to O-1 grade and waferboard conforming to R-1 grade shall be not less than 7.9 mm thick where applied directly to sheathing.
- Where applied directly to framing or over furring strips, OSB conforming to O-1 grade and waferboard conforming to R-1 grade shall be not less than
- 9.5 mm thick on supports spaced not more than 400 mm o.c., and
- 12.7 mm thick on supports spaced not more than 600 mm o.c.
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| 9.27.10.3. |
Panel Cladding
- OSB and waferboard applied in panels shall have all edges supported and treated with a primer or sealer.
- Not less than a 3 mm gap shall be provided between sheets in cladding described in Sentence (1).
- Vertical joints in cladding described in Sentence (1) shall be protected with batten strips or sealant when the OSB and waferboard joints are not matched.
- Horizontal joints in cladding described in Sentence (1) shall be lapped not less than 25 mm or shall be suitably flashed.
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| 9.27.10.4. |
Clearance
- Not less than a 3 mm clearance shall be provided between OSB and waferboard cladding and door or window frames.
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